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    Technical Capability
    MP batch of PCB
    Range Item Capabilities
    Normal Layers Count ≤36L
    Board Thickness 0.30-6.0mm
    Thickness Tolerance ±10%
    Max PNL Size 610mm*710mm
    Warpage(Min) ≤0.5%
    Impedance Tolerance Differential impedance≥50Ω ±8%
    Characteristic impedance≤50Ω ±10%
    Stack up PP Thickness ≥ 2.0mil
    Drilling Min Drilling diameter 0.15mm
    Hole diameter tolerance PTH ±0.05mm
    NPTH ±0.025mm
    Plating Aspect Ratio of Plated Hole(Max) 30:1
    Line Design Inner Layer Layers：4-10L ≥5 mil
    Layers: 12-16L ≥6 mil
    Inner Layer Line Width/Space Inner Layer HOZ 2.5/2.5mil
    Max Base Copper Inner Layer ≤5OZ
    Outer Layer ≤5OZ
    Outer Layer Line Width/Space 2.6/2.6mil
    Line width tolerance Impedance Line ±10%
    None Imped Line ±20%
    Pad Tolerance Pad≥10mil ≥±10%
    Back Drill Back Drill STUB 5±3mil
    BGA(Dual Lines) Back Drill Capa 37/(35)mil
    Back Drill Accuracy (Hole to Hole) D+8～D+6mil
    Back Drill Accuracy (Hole to Line) ≥4.2mil
    Solder Mask Solder Mask Bridge ≥3mil
    Solder Mask Thickness Line to Surface 10-40um
    Line to Corner ≥10um
    Routing Tolerance ±0.1mm
    POFV Design Aspect Ratio 30:1
    Line Width/Line Space 3.5/3.5mil
    Special Process Asymmetry Hybrid, Skip Via（1-3）
    CCL Capa M7/PTFE、、ULL+FR4 Hybrid
    Electrical Property SI Simulation/Analysis，，，，SI Control（44Ghz）
    Surface Treatment Gold-plated plug Gold thickness 0.127-1.0um
    ENIG Gold thickness 0.03-0.10um
    OSP Film thickness 0.2-0.6um
    HASL lead free 1-25um
    Immersion Silver 6-15u"
    Immersion Tin 0.8-1.2um
    Sample and Small batch of PCB
    Range Item Sample batch Capa Small batch Capa
    Normal Layers Count ≦108L ≦46L
    Board Thickness 0.2~13.0mm 0.4~6.5mm
    Thickness Tolerance ±8% ±10%
    Impedance Tolerance Differential impedance≥50Ω ±8% ±10%
    Characteristic impedance ≤50Ω ±2.5Ω ±5Ω
    Warpage(Min) ≦0.3% ≦0.75%
    Stack up PP Thickness ≧3mil ≧3mil
    Drilling Min Drilling diameter 0.125mm 0.15mm
    Hole diameter tolerance PTH ±0.04mm ±0.05mm
    NPTH ±0.025mm ±0.05mm
    Plating Aspect Ratio of Plated Hole(Max) 30:1 25:1
    Line Design Inner Layer Layers: 4-10L ≥5.5mil ≥6.5mil
    Layers: 12-36L ≥7mil ≥7mil
    Inner Layer Line Width/Space Inner Layer HOZ 2.0mil/2.0mil 3mil/3mil
    Max Base Copper Inner Layer 28OZ 6OZ
    Outer Layer 28OZ 6OZ
    Outer Layer Line Width/Space 30-40um 3/3mil 3/3mil
    40-55um 3.5/3.5mil 4/4mil
    总铜:40~55um 3.5/3.5mil 4/4mil
    Line width tolerance Width≥10mil ±15μm ±1mil
    Width<10mil ±10% ±10%
    Pad Tolerance Pad≥12mil ±1mil ±1mil
    Solder Mask Solder Mask Bridge 3.5mil 4mi
    S/M Plugging Plugging diameter hole 5mil 5mil
    S/M Thickness Line to surface 10~40μm 10~40μm
    Line to corner ≧5μm ≧5μm
    Routing Tolerance ±0.1mm ±0.1mm
    Surface Treatment Gold-plated plug Gold thickness 0.127~2μm 0.127~1.25μm
    Ni thickness 2.54~6μm 2.54~6μm
    ENIG Gold thickness 0.03~0.2μm 0.03~0.2μm
    Ni thickness 2.54~6μm 2.54~6μm
    OSP Film thickness 0.2~0.6μm 0.2~0.6μm
    HASL lead free 1~40μm 1~40μm
    Immersion Silver 6~15u" 6~15u"
    Immersion Tin 0.8~1.2μm 0.8~1.2μm
    Gold Finger Gold thickness 0.127-2μm 0.127-1.25μm
    Length Tolerance (Etching) ±0.15mm ±0.15mm
    Length Tolerance (Solder Mask) ±0.1mm ±0.1mm
    Width Tolerance ±25μm ±40μm

    Surface treatment: HASL lead free, immersion gold, immersion Tin, immersion Silver, Gold Finger, Hard/Soft gold plating, OSP, ENEPlG and Selective hard gold plating.

    Materials:FR4, Rogers, Arlon, Taconic, Bergguist, TUC, Panasonic M6/M7 and so on.

    Special technology:Blind & buried holes, Via in pad, Castellated holes, Counterbore, Step mounting holes, Controlled depth holes, edge-plating, metal base PCB, Stepped G/F, Back-drill, Mixed RF PCB, Busbar PCB, Copper coin embedded and Ceramic coin embedded.

    FPC & RFPC
    No. Item Capabilities
    1 Layers Count FPC：1-6L
    RFPC：2-10L
    2 Finished Board Size(Max) 19.7″×19.7″
    3 Major CCL Brand Doosan\Thinflex\Shengyi\Taiyo\DongYi
    4 Finished Board Thickness Tolerance ±0.03mm(Thickness≤ 0.2mm)
    ±0.05mm(0.2mm＜Thickness≤0.5mm)
    5 Blind/Buried Hole YES
    6 Min Drilling Hole Diameter Mech Drilling：0.1mm~6.5mm
    Laser Drilling：0.1-0.125mm
    7 Base copper of outer layer 1/3 OZ-2OZ (0.012mm -0.070mm)
    8 Base copper of inner layer 1/3 OZ-1OZ (0.012mm -0.035mm)
    9 Board Thickness 0.07mm-2.0mm
    10 Aspect Ratio of Plated Hole(Max) 8:1
    11 Hole Diameter Tolerance (PTH) ±3mil ( ±0.075mm)
    12 Hole Diameter Tolerance (NPTH) ±1mil ( ±0.025mm)
    13 Copper Thickness of PTH Wall 10um min or base on customer requirement
    14 Design Line Width /Space of inner layer (Min) H/H OZ 3mil/3mil
    1/1 OZ 4mil/4mil
    2/2 OZ 5mil/5mil
    3/3 OZ 6mil/6mil
    15 Design Line Width /Space of outer layer (Min) H/H OZ 3mil/3mil
    1/1 OZ 3mil/3mil
    2/2 OZ 4mil/4 mil
    3/3 OZ 6mil/6mil
    16 Solder Mask Bridge Width (Min) 2.5mil (0.064mm)
    17 Solder Mask Alignment Tolerance ±2mil (±0.05mm)
    18 Coverlay Bridge Width(Min) 8mil (0.2mm)
    19 Coverlay Bridge Alignment Tolerance ±6mil (±0.15mm)
    20 Dimension Tolerance (Hole to Edge) ±4mil (±0.1mm)
    21 Test Capacity PAD Size min (0.1mm)
    PAD Pitch min (0.4mm)
    22 Stiffener Type PI\FR4\SUS
    23 Electromagnetic Shielding Technology Film / Silver Paste
    24 Surface Treatment OSP，，，ENIG，，Plating Gold
    HDI PCB
    Item 2025 2026 2027
    HDI Blind Hole Structure 5+N+5 6+N+6 7+N+7
    Drilling hole diameter (um) Min Blind Hole 75 75 75
    Min Buried Hole 150 150 150
    Min Through Hole 150 150 150
    Max Aspect Ratio Laser Blind Hole 1 ：1 1.2 ：1 1.2 ：1
    Through Hole 20 ：1 25 ：1 30 ：1
    Min core without copper thickness (um) 50 50 50
    Finish Board Thickness (mm) 0.40~3.2 0.30~4.0 0.25~5.5
    Laser Hole Filling Dimple (um) 10 8 5
    Hole Tolerance (um) PTH ±50 ±50 ±40
    NPTH ±0.025 ±0.025 ±0.025
    Warpage ≤0.6% ≤0.5% ≤0.4%
    CNC Routing Tolerance (um) Mass Production ±100 ±75 ±50
    Sample Production ±50 ±50 ±50
    Impedance Tolerance ±10% (±8%) ±8% ±8%
    Line Capability (um) Line Width ~45 ~40 ~35
    Line Space ~45 ~40 ~35
    Min BGA Pad Size (um) 150 100 75
    Min BGA Space (Pitch) 0.30mm 0.25mm 0.25mm
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